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X-BGA-DP includes:
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This set facilitates application of paste flux (or paste) onto the balls under the BGA packages. The plates can be ordered to accommodate different component sizes and ball diameters.
How to use the dipping system:
Part Number | Size | Depth |
X-BGA-DP-15x15x0.15 | 12,5x12,5 mm | 0.15 mm |
X-BGA-DP-18x18x0.15 | 18x18 mm | 0.15 mm |
X-BGA-DP-25x25x0.15 | 25x25 mm | 0.15 mm |
X-BGA-DP-15x15x0.25 | 15x15 mm | 0.25 mm |
X-BGA-DP-20x20x0.25 | 20x20 mm | 0.25 mm |
X-BGA-DP-30x30x0.25 | 30x30 mm | 0.25 mm |
X-BGA-DP-20x20x0.40 | 20x20 mm | 0.40 mm |
X-BGA-DP-30x30x0.40 | 30x30 mm | 0.40 mm |
Interested
Companies to distribute this product in their countries are welcome to contact: czes@bokar.com or call USA at (570) 842-2812 This is a tool which is designed to make SMT rework easier, less time consuming and properly done to guarantee appropriate process control. |
TO BUY
please see SMT Distributor in Your Country |